During the stress test of a new CPU, the thermal band behaved unusually.
During the stress test of a new CPU, the thermal band behaved unusually.
The CPU warping leads to a reduction in the copper/copper surface, and sometimes the thermal grease becomes too thin, causing separation between the contact area. This is the core issue with the 12/13 Gen Intel CPUs. The problem stems from the chip's shape—rectangles tend to bend more than squares. Usually, thermal spikes are normal, but this design is extremely problematic. Intel implemented a dual-laden socket for the X99 (5000 series) LGA and used a single loading mechanism, claiming it’s acceptable. Just trust me, bro.
It’s a pretty obvious design decision. They could simply add another clamping point on each side and place them at the one-third marks of the CPU. The additional expense would be around five cents per retention mechanism.