Working on the cleaning of thermal paste from this processor will be quite challenging...
Working on the cleaning of thermal paste from this processor will be quite challenging...
I understand what Dr. Lisa Su shared is just an initial engineering prototype, and it hasn't been finalized yet. I'm curious if any of the engineers considered the challenges of removing thermal paste from this design before deciding. Cleaning between components would be quite laborious, even though it's not a frequent task. Is this something you've observed before or have others had similar thoughts?
Maybe those gaps can be sealed with epoxy or a comparable material to close them in.
The openings were designed to fit those pins. These pins are for testing, so you can anticipate a typical IHS pattern in the finished part.
Observe just how tiny it is compared to the PCB—it's quite charming.
I'm more impressed by AMD shifting their desktop line to LGA. Finally, people won't keep pulling CPUs out of sockets just to remove coolers. Still, we should keep an eye on the final build. If thermal paste isn't overdone, it shouldn't be too bad. A Q-tip or two should tidy up the edges nicely. Or everyone might switch to using graphite sheets—they've worked wonders for me.
Consensus, use minimal thermal paste. Apply it, press gently, and remove it promptly if it starts to become sticky.
They don't resemble typical test pins. These are surface mount pads, and some appear to be connected. It's possible they'll omit certain ones in the final design.