Innovative method for cooling that eliminates the need for thermal paste.
Innovative method for cooling that eliminates the need for thermal paste.
Considered an alternative approach instead of thermal paste. Instead of using paste, we could install slots on both the CPU IHS and Cooler Pad, then align them before mounting the CPU in the motherboard socket. This would eliminate any air gap between the IHS and Cooler Pad, potentially improving heat transfer. Not sure if anyone has tried this before. I’d appreciate it if Linus experiments with it and compares the outcomes to standard coolers with paste.
There would remain some inconsistencies because the current method isn't perfectly accurate enough, creating a minor difference. It's not ideal for thermal performance.
I believe OP is envisioning a setup where the cooler's cold plate and the IHS stack function like Lego pieces. As mentioned in my reply to the double comment, achieving this demands an extremely accurate manufacturing method with tight tolerances. We must use thermal paste since producers can't guarantee both components are perfectly flat. The paste bridges the tiny gaps between them. This situation is similar here—unless the parts align flawlessly at a microscopic scale, you'll still encounter gaps needing filling. Now your production process becomes more intricate, costly, and susceptible to compatibility problems between the parts.
You're referring to the challenges of installation. The process demands careful handling due to potential friction and wear from any tilt. Tight tolerances can make it difficult for users to assemble properly, requiring a gap that must be filled with thermal paste again. Applying and removing it becomes more complex. Having two flat surfaces is simpler to produce and manage, likely offering better cooling performance.
I understand OP didn't intend it, but just reading it made me think they might have created cooling pads on the spot! In my opinion, this isn't a good choice for everyday use since it's unclear how to set it up and whether any real benefits exist. It would be smarter to focus on creating more energy-efficient components, which is already happening with longer-term improvements. I own two Ryzen processors in the past half-year; while I've often felt a bit let down by their performance (I seem to prefer picking the wrong model), they’ve always been decent. The 3600 really stands out compared to the 2200G—it can get warm during tests even without the graphics card, but it stays manageable under typical use. PS: I also thought about a solution—if cooling efficiency is an issue, maybe integrate the CPU, cooler, and motherboard together from the start. That would be the most effective approach, though it depends on cost and whether enough research is needed. Plus, people might not like the idea of being told they can't upgrade their CPU!