Encountered an issue during the delidding process and broke a CPU die. Assistance needed.
Encountered an issue during the delidding process and broke a CPU die. Assistance needed.
Positive notes. My 8700K fell 15-20°C (not soldered), gained 2700x 5-10°C (minor scratch on PCB, still functional). Soldered version shows no change. 220g no variation. (not soldered) Passive cooling setup.) Ryzen 3 1200 shows no difference. Soldered version same.
Looks good... I think I’m safe on my process. What about the chip effect performance?