Application became inconsistent once the component was removed
Application became inconsistent once the component was removed
Possible poor connection? In any case, liquid metal works best for delidded CPUs.
Applied thermal paste between the IHS and CPU die. Tested various pastes and liquid metals to see what worked best. Found that using liquid metal helps reach stock temperatures. Delidding is recommended for this method. I recall reading about some people needing to service it every couple of years after delidding due to issues with liquid metal. This particular unit has been untouched for over six years and still performs well, dropping temperatures by nearly 20 degrees under load. However, I wouldn't repeat this process and I don’t think it’s essential.
The outcomes showed noticeable differences based on the setup, making it somewhat of a skillful process. With liquid metal, the quality of results is much better than with thermal paste, even when using less-than-ideal methods.
I also discovered that using a small shim made from just a couple layers of electrical tape on the PCB helped a lot (after removing the adhesive). Applying thermal paste to the core die was extremely difficult and it wore out quickly—only about three months before failure. It became a regular upkeep task for me, honestly. P.S.: Don’t try that—I accidentally smudged the IHS.
Consider a premium thermal pad for better performance. This link provides an example: https://www.amazon.com/Thermal-Grizzly-K...B0C61NWNZH
That approach should function, though keep in mind KryoSheet is conductive, not reusable, and hard to secure as it can shift easily. You might prefer PTM 7950 instead. Also, the 4770k I’ve been using since around 2015/2016 remains stable in its overclocked form with the original LiquidMetal setup (now on friends PC). I removed the adhesive from both IHS and CPU, painted nail polish on small SMD parts near the CPU die, applied liquid metal on the CPU die and IHS, placed the CPU into the socket carefully, then secured it by clamping while pressing the IHS onto the CPU. Finally, installed the cooler with thermal paste.
Could placing the thermal paste on both the IHS and the die work?
The goal is to minimize the Z-height gap between the CPU die and IHS, and thermal paste thickness should be consistent over time. I’ve worked with LM, graphene pads, and PTM 7950. I recommend going with PTM 7950 for its advantages without the extra complexity and risks. Refer to my earlier note for more details.