Application became inconsistent once the component was removed
Application became inconsistent once the component was removed
Terrible contact issue, excessive gap between IHS and CPU. Take off the adhesive from the CPU. Use a plastic credit card or similar tool.
Yes, your knife is likely fine. The super glue near the IHS suggests a strong bond, which can be good for durability. The feeling of the CPU only touching the die might mean the solder joint isn’t fully seated, so you may need to adjust pressure or ensure better contact with the PCB. It’s normal for some initial issues during assembly.
Did you remove the old adhesive from the CPU during the first time? The original silicone keeps the IHS separate from the die. It’s okay to reapply a little, but avoid covering it completely. Look at one of my CPUs—it’s fully cleaned, ready for liquid metal, with no glue near the edges (the contacts have a layer of nail polish over them). If you simply took the IHS off and then attempted to refill the thermal paste, that adds another issue on top of using standard paste. What matters is understanding the differences between what connects the CPU die to the IHS and what connects the IHS to the heatsink.
while testing beforehand, I marked the center of the die with a dot, then repositioned the IHS. I observed minimal thermal paste in the middle, mostly on the sides. Could this be due to excessive pressure? Regarding the PCB, how sturdy is it? Is it safe to use a knife to remove silicone?
The connection is poor due to excess glue and thick paste buildup on the die. Aim for a thin layer to avoid acting as an insulator instead of a thermal conductor. The knife isn't suitable unless you're certain you won't make any mistakes that damage the PCB or yourself.
You're asking about the longevity of your setup running at 62°C in Prime95 Small FFTs without AVX support. It's a good question about thermal limits and performance stability. The answer depends on factors like cooling efficiency, workload intensity, and component quality. Running consistently at that temperature for a year is challenging—expect gradual wear over time. If the cooling system performs well, it might last longer, but eventually, sustained high temperatures will affect reliability.
The duration depends on the environment, but removing the adhesive and silicon allows better heat transfer, which can extend performance. Thermal paste helps conduct heat more efficiently. At low temperatures, insulation might reduce effectiveness, so expect shorter lifespan unless conditions are controlled.
No one has a response. The question is beyond solving. It might take decades or vanish completely.