VRMs overheating?
VRMs overheating?
Hey, if you're going through a lot of steps to cut the heat, maybe it's time to swap that motherboard for something better. I don't have time for all this hassle.
I tried several overclocks and noticed that pushing the iGPU to 1650MHz caused temperatures to rise quickly to around 110°C. To manage this heat, would the laptop produce noticeable noise? I’m considering adding heatsinks and wondered if this issue would be permanent. Once I switch to a dedicated GPU and attempt overclocking, do you think the VSOC MOS would stop heating up?
Also could you clarify what those silver squares are? Would it be possible to place my support around the heatsinks using them?
The silver square bits beside the mosfets are labeled with yellow—those are inductors. They function like coiled wires wrapped around a ferrite core, with plastic or epoxy casings inside to reduce vibrations and whine caused by magnetic fields. These inductors will get warm from heat absorbed in the circuit, but they shouldn’t need extra cooling. Applying heatsinks would be tough because of the stylized 'P' marking on top. The enclosure should use non-conductive material like plastic so that if heatsinks attach, it won’t cause problems. If you skip integrated graphics, the mosfets will run cooler since they operate more efficiently in certain areas. In short, they perform poorly at low loads but generate little heat when it does appear, and high loads cause excessive warmth.
Thanks for the clear explanation. I’m considering using conductive tape instead of a heatsink, but I want to make sure it stays securely in place. I’m thinking about attaching it to both the VRM on the bottom and the sides, which seems reasonable. This is in response to the issue with the heatsink that might detach (the one highlighted green).
You might need to find a method to apply pressure on the heatsink. The thermal pad on the M.2 heatsink isn't sticky, so the chip won't grip the components. Pressure is necessary for heat to move from the chips into the M.2 heatsink via the pad on the bottom. Compared to individual chips with fins or ridges, this setup offers more surface area and should perform better. It's at least a decent solution.
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