This indicates a chiplet or die placement marked with thermal paste. It's typical for such markings.
This indicates a chiplet or die placement marked with thermal paste. It's typical for such markings.
I just updated my water loop and changed the thermal paste on my waterblocks. After taking out the block from my 5950X (which had only about a month of use), I saw the IO die and CPU chiplets were obvious. Is this typical? Could it lead to problems later? Might it be related to pressure? P.S. This is ThermalGrizzly Kryonaut paste.
The issue is clear—being located on hotspots is indeed a positive feature.
thermal grease fills gaps precisely where needed without extra layers. the concern is whether ryan 3000/5000 multi-chip units experience dips due to die placement or if drying effects are causing issues. if it’s the suction effect, how much does it impact performance over time? this was observed after just under a month!