Thermal compound designed for efficient heat dissipation.
Thermal compound designed for efficient heat dissipation.
I've noticed one Twitch streamer who frequently delides 12th Gen hardware without warming it up first. The soldering process appears to release easily. I intend to apply heat myself. Most opinions suggest a delid at 8–10°C is ideal for this setup. I’ll post my results later this week. During synthetic tests, my gaming runs between 75 and low 80s. Will the additional 8–10°C stop the thermal throttle in Cinebench or push me closer to 5.5 during games?
Update: I can definitively say that standard TIM under the IHS is worse that the stock solder. I used Noctua NT-H2 and I probably lost 10C on cooling over the soldered IHS. I tested 5.2Ghz at 1.35v right before doing the delid. It would top out at 89C after 10 minutes on Cinebench R23. Those exact same settings after the delid thermal throttle on the first pass. So, unless my application is terrible, which it could be, it's worse than before. I'm still waiting for the conductonaut to be delivered later this week. I'm optimistic that will improve. Linus saved about 10C when he delided his 12900K in the RockitCool video. There's another guy on Twitch that I've seen delid several 12th gen processors live and they netted about 10C using the RockitCool delid kit. The delid itself was super easy. No issues there. Update: Using liquid metal did lower temperatures 10C over the stock solder. I tested again today after applying LM and letting it cure overnight. 5.2Ghz all core, 1.35v, topped out at 79C on a 10 minute loop of R23. Exactly 10C reduction. It also pulled about 10-15 less watts as well, even though the voltage and core clock was the same. A guy I follow noticed the same thing. He thought that the lower temperature could be the reason why it pulled slightly less wattage. Edited November 12, 2022 by 1982 Original Updating results.