The thickness of a Pentium G3260 die is not typically specified in standard sources.
The thickness of a Pentium G3260 die is not typically specified in standard sources.
I broke down the CPU and removed the die to see the chipset, but it’s proving difficult. Other videos showed sanding from the bottom up, but I prefer keeping the die on the package. I’m now focusing on sanding from the thicker top side down to the chip area. How thick is the die from the top of it all the way to the chip location?
Threads combined, ensure uniqueness. The core measures around a hundred microns or two on the opposite side. Expect fragmentation or flaking before reaching it, as material loss reduces integrity and the base lacks a flat surface due to contact imperfections.
It's great to hear you're working on this project, but please be careful. Handling acids and X-rays without proper safety gear is risky. Stick to safer methods if possible.
Avoid harsh substances; remove the die and smooth the circuit surface after thorough setup.
I can't believe I'm having to disprove a mod right now. It seems I chose to test on a RAM die instead of the CPU. After sanding it from top to bottom, I saw the actual die. Given these RAM dies have much less connection to the PCB with just a few solder pins, I'm confident the same approach would work for a CPU too. IMG_2120.MOV