The chiplets are integrated within the Zen3 processors.
The chiplets are integrated within the Zen3 processors.
I've heard some discussions about a "three spot" thermal paste layout being slightly better than the standard pea shape for chiplet setups. I'm curious if this is widely known and where the chips fit within the Zen3 series. My initial thought was that the IO chip would likely sit in the middle of the package, but I'm not sure if the core CCXs would be positioned above or beside it. Usually these details aren't major, but I wanted to confirm before finalizing my plan. Thanks!
When the CPU is placed in the socket, the I/O chiplet sits at the top while the CPU chiplets are positioned lower. der8auer previously offered "OC brackets" for caseking that display the die arrangement: X method is the superior choice. Spoiler: CPU in the standard orientation (as shown in marketing materials): Spoiler