F5F Stay Refreshed Hardware Desktop Removal of the roof increased temperatures.

Removal of the roof increased temperatures.

Removal of the roof increased temperatures.

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Designx
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219
03-19-2017, 10:40 PM
#11
8700k retained its original paste for the IHS LM; they began applying solder only from the ninth generation onward.
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Designx
03-19-2017, 10:40 PM #11

8700k retained its original paste for the IHS LM; they began applying solder only from the ninth generation onward.

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Pipper1222
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187
04-03-2017, 11:36 AM
#12
Correct measurement allows you to safely change your cooler's mounting method, removing the IHS completely.
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Pipper1222
04-03-2017, 11:36 AM #12

Correct measurement allows you to safely change your cooler's mounting method, removing the IHS completely.

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DzikSonJD
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141
04-09-2017, 02:42 AM
#13
I cleaned thoroughly by repeatedly using rubbing alcohol and a plastic scraper until the surface was smooth.
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DzikSonJD
04-09-2017, 02:42 AM #13

I cleaned thoroughly by repeatedly using rubbing alcohol and a plastic scraper until the surface was smooth.

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Super_Janemba
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162
04-09-2017, 03:20 AM
#14
I’m not sure about directing Die Cool, which is why I prefer using an IHS instead.
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Super_Janemba
04-09-2017, 03:20 AM #14

I’m not sure about directing Die Cool, which is why I prefer using an IHS instead.

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Tyler_MC
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227
04-09-2017, 06:18 PM
#15
I completed LM on an i7 8700k and achieved a 20-degree temperature drop. When reassembling, placing the IHS correctly is crucial—center the pressure point at the top of the CPU core beneath the IHS so the surfaces align perfectly. I used a heat-resistant silicone sealant suitable for automotive applications as the adhesive. After letting it cure for several hours before taking apart, testing the CPU ensures even contact. If you skip resealing, maintaining flat alignment across all mounting points becomes extremely challenging.
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Tyler_MC
04-09-2017, 06:18 PM #15

I completed LM on an i7 8700k and achieved a 20-degree temperature drop. When reassembling, placing the IHS correctly is crucial—center the pressure point at the top of the CPU core beneath the IHS so the surfaces align perfectly. I used a heat-resistant silicone sealant suitable for automotive applications as the adhesive. After letting it cure for several hours before taking apart, testing the CPU ensures even contact. If you skip resealing, maintaining flat alignment across all mounting points becomes extremely challenging.

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Turkir
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193
04-16-2017, 02:40 AM
#16
I have already considered other options by conducting detailed tests and precise installation. According to GN, it's best to avoid using any adhesive since it can leave a space between the IHS and die, and there are supporting data available.
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Turkir
04-16-2017, 02:40 AM #16

I have already considered other options by conducting detailed tests and precise installation. According to GN, it's best to avoid using any adhesive since it can leave a space between the IHS and die, and there are supporting data available.

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sullycraft17
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29
04-22-2017, 07:09 AM
#17
This ensures the adhesive sets correctly while the parts are pressed together. I also own a Delid Mate 2; its locking system only makes contact at one point per side, allowing smooth sliding when locked. Without sealing, it could shift out of place. Why did they begin using a contact frame for the LGA1700 connectors?
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sullycraft17
04-22-2017, 07:09 AM #17

This ensures the adhesive sets correctly while the parts are pressed together. I also own a Delid Mate 2; its locking system only makes contact at one point per side, allowing smooth sliding when locked. Without sealing, it could shift out of place. Why did they begin using a contact frame for the LGA1700 connectors?

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