Removal of the roof increased temperatures.

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Santonite
Member

208

02-28-2017, 10:22 AM

I removed the 8700k and applied LM to the die. The results were positive – +10C on idle compared to before and 6118 on Cinebench R23.2 multicore, which is better than expected. I experimented with the thinnest layer possible, a bit more than usual, and they all produced similar outcomes. I made sure the cooler contact wasn’t the problem and am now unsure about the next steps. Any guidance would be appreciated.

Santonite

02-28-2017, 10:22 AM #1

MrN1G4PT
Member

242

02-28-2017, 02:33 PM

Test a standard thermal paste to determine its effectiveness.

MrN1G4PT

02-28-2017, 02:33 PM #2

Test a standard thermal paste to determine its effectiveness.

KeetchuupBoy
Member

03-01-2017, 03:56 PM

Yes, you applied LM on both the CPU die and within the IHS to improve bonding contact.

KeetchuupBoy

03-01-2017, 03:56 PM #3

Yes, you applied LM on both the CPU die and within the IHS to improve bonding contact.

Smiley_Pixel
Junior Member

03-08-2017, 04:58 AM

You're asking why the IHS is still being used. Let me clarify that for you.

Smiley_Pixel

03-08-2017, 04:58 AM #4

You're asking why the IHS is still being used. Let me clarify that for you.

Areeend
Member

142

03-08-2017, 10:36 AM

Yes, all three times.

Areeend

03-08-2017, 10:36 AM #5

Yes, all three times.

Yox24
Junior Member

03-08-2017, 10:46 AM

Likely at Z height, a heatsink won't connect with a delidded CPU unless it's made for that setup. @Ryguyx Are you testing without planning to use a custom hard-mounted cooler?

Yox24

03-08-2017, 10:46 AM #6

Likely at Z height, a heatsink won't connect with a delidded CPU unless it's made for that setup. @Ryguyx Are you testing without planning to use a custom hard-mounted cooler?

Tornado089
Junior Member

03-09-2017, 10:09 AM

Residing in a developing nation limits my access to copper, and I'm hesitant about handling direct dies.

Tornado089

03-09-2017, 10:09 AM #7

Residing in a developing nation limits my access to copper, and I'm hesitant about handling direct dies.

ObviouslyAlex
Junior Member

03-18-2017, 04:31 AM

It’s about ensuring accuracy despite adjustments for z-height. Even with IHS usage, the process remains valuable.

ObviouslyAlex

03-18-2017, 04:31 AM #8

It’s about ensuring accuracy despite adjustments for z-height. Even with IHS usage, the process remains valuable.

samnicholas34
Member

144

03-18-2017, 05:50 AM

Only the goal was to swap die TIM with LM

samnicholas34

03-18-2017, 05:50 AM #9

Only the goal was to swap die TIM with LM

Vren
Member

117

03-19-2017, 10:31 PM

#10

Verify completely that all adhesive was removed from the IHS onto the die. Remaining residue could prevent optimal contact between the IHS and the die.

Vren

03-19-2017, 10:31 PM #10

Verify completely that all adhesive was removed from the IHS onto the die. Remaining residue could prevent optimal contact between the IHS and the die.

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