Perform a damage inspection for delamination issues.
Perform a damage inspection for delamination issues.
Hello fellow experts, I'm curious if any of the minor marks I left on the CPU's PCB during removal might have affected its performance. My system operates smoothly and meets all stress test requirements. The upgrade changed the stock Intel ILM to DrBauer's contact frame, which is why I've noticed some visual issues a couple of times since installation. These problems usually resolve quickly after shutdowns and pressure adjustments. Based on what you've shared, it seems more likely these are tied to my ongoing testing and pressure tweaking rather than a major fault. Looking at the images below, do they reveal any significant concerns about the CPU itself?
This makes perfect sense after examining the PCB closely. It was reassuring to confirm the traces were positioned well below the surface, confirming it wasn’t an optical trick. It seems I just need to fine-tune the mounting pressure and everything should work. The key takeaway from this experience is that re-gluing the IHS isn’t needed—mounting pressure will secure it firmly. Additionally, leaving it unglued reduces the chance of damaging the CPU during future lid removal or maintenance.