No, it doesn't need to be liquid metal.
No, it doesn't need to be liquid metal.
It doesn’t necessarily need liquid metal between the CPU and IHS. Some designs use solid materials instead, like Artic Silver. Liquid metal is often preferred for its thermal conductivity, but it can be risky. Regarding heat differences across cores, an IHS with a sloped side can help spread or concentrate heat depending on the layout. Let me know if you need more details!
I don’t favor liquid metal because it’s damaging. I opt for diamond paste, even though it’s less efficient, since it lasts longer and doesn’t require constant replacement.
doesn't need to be, yet it offers the top thermal conductivity and transfer. The IHS might not be ideal, which could mean more space between die sections than usual. Sometimes the imperfections in IHS size and others result from inconsistent TIM use or mounting force.
It doesn't need to be liquid metal; most stock CPUs aren't either. Arctic silver is outdated and of poor quality—consider alternatives like Kryo or MX4 for better performance.
Good book, stayed solid for about two and a half years. It looks like the problem mainly comes from overusing LM and moisture leading to corrosion. I kept the amount small—no obvious droplets—and still got decent outcomes. Since I haven’t inspected it in two years, I can’t confirm the exact condition. Likely won’t adjust it unless I replace the device.