Looking for guidance on TIM reapplication?
Looking for guidance on TIM reapplication?
I'm updating the ROG laptop's thermal paste as it's overheating unexpectedly. After removing the heatsink, I discovered this material. (In PIC: the LM TIM was included with the ROG laptop but stopped working due to thermal throttling during idle. I should replace it.) I'm wondering if swapping it for a cooler compound like mx-4 or nt-h1 on the GPU and other chips is feasible, or should I opt for thermal pads instead. Also, could applying liquid metal be beneficial compared to pastes? Also, I've noticed this processor reaches very high temperatures (up to 96°C) on startup and consistently throttles in games or heavy tasks.
The blue material in the image isn't part of the GPU memory; those are bottlenecks. The components on the green board at the bottom right are the actual memory. If there aren't thermal pads there, you could add some, though that seems unlikely to be a problem. Apply a pea-sized drop of isopropyl alcohol to a qtip and clean the die thoroughly, placing it in the center. To confirm, is this the CPU or GPU shown? I’d also repaste the GPU with an equal amount if needed.
I didn't capture the image with GPU memory, it's on the left side (the PIC is a CPU) and I didn't take a photo, but I noticed the memory modules have the same branding as Samsung. I'm considering reapplying the Thermal Grizzly liquid metal only for the CPU, do you think it's worth it? I believe Asus did this during manufacturing since these CPUs produce a lot of heat (I think all 10th gen ROGs use a liquid metal for the CPU).
You might try, but handle it with extreme caution and avoid any leaks. It's similar, just a small adjustment near the center of the die. Ensure the laptop is designed to work with liquid metal.
Asus incorporated liquid metal, protective coatings, and other enhancements, but caution is still necessary.