LGA 1700 deli and liquid metal components
LGA 1700 deli and liquid metal components
People optimize CPUs by boosting performance and lowering temperatures. I planned to record the steps because I shared both my 13700f and 13900 units; it’s generally safe following these tips. I began heating the CPU using a hot air soldering station at 200°C for two minutes, or a heat gun would work too. After that, I opened the lid with a deliding tool and tweezers, making sure not to use your fingers on the hot surface. Using a razor blade, I cleared as much solder as possible, then applied polish until everything was removed. I also took out all silicone glue—liquid metal is tricky to handle; apply it to both the CPU die and lid, but avoid direct contact with the die since liquid metal conducts electricity. After reassembly, I tested the board and saw a 4°C improvement. Let me know if you want more detailed information.