Lapping a cpu
Lapping a cpu
You're curious about Ryzen CPUs and their performance metrics. It seems you're checking if there are any reviews or comparisons involving high-performance models like the 9900K. Currently, there don't appear to be any Ryzen CPU reviews specifically mentioning "lapping" or similar benchmarks. It might simply mean that Ryzen processors aren't being evaluated in that context yet. If you're interested, I can help you explore Ryzen's capabilities and performance in more detail.
Zen employs excellent solder, which often leads to further complications.
The main goal of aligning the IHS plate on a Ryzen CPU is to remove the concave section. Lapping the cooler provides two matching surfaces, which helps reduce the amount of thermal interface material needed. This can slightly improve temperatures by just a few degrees. Swapping out the delid doesn’t seem to make much difference. Several factors are involved. My HTPC uses a delidded 2700x, and temperatures remain almost the same. I continue using the IHS plate with TIM instead of solder and the original cooler. Temperatures could be up to 5°C higher at most. The heat produced by Ryzen chips comes mainly from dense transistor packing, and there’s no permanent fix for the resulting heat buildup or spikes.