Laplace du puce CPU
Laplace du puce CPU
I've studied numerous high-performance overclocking guides and forums. Experts often share practical insights based on real-world testing, rather than strict technical specs. While there aren't official die maps detailing exact unoccupied space, many recommend consulting community discussions and manufacturer recommendations to gauge safe removal limits.
In this video it looks like they're using a fixture to guide them to the correct depth: When the fixture starts getting sanded on then they stop. There really isn't a "safe" amount to take off because that was already done at the fab in a process called backgrinding....which uses a diamond slurry deal. Sandpaper is extremely crude.
I favor testing with real heat before chasing the fastest CPU. You need a chip from the same generation if someone has already beaten their own die, and you should show how much you can handle before it fails. As for whether it’s worth it, it depends on how much time and effort you’re willing to invest—most people say it’s not worth it because they’re just trying to keep up out of habit or laziness. If I’d already risked damaging my CPU, I’d probably go all in to beat the temperature drop.
It's still simpler said than done, but it helps you grasp pressure application. Wood blocks and sandpapers are more affordable options. You must focus on getting the right thickness, as @OhYou_ mentioned; otherwise, you'll end up with a dead daily driver. I wouldn't risk it if it's your main desktop, particularly on a rare 12900KS. Getting the contact frame in is about 60% of the challenge anyway.
I’m not planning to use die lapping on my existing equipment. The design I’d choose would likely include direct die water cooling, which is expected to be several years away. I’m just curious about how the process works.
It's not about your effort—it's about knowing when an action has no value. You just lowered your peak temperature by two degrees. What benefit did that give you? You won't be able to increase the voltage, and even if you could, every chip developed over the past few years has faced speed restrictions before thermal limits were reached. We're not considering the chances of damaging the silicon right away or later after repeated thermal cycles. The only real interest would be if you're targeting a top-tier chip with extreme thermal constraints, like the new w9s. But don't expect to save much by spending around $5k.