It seems you're asking about clearing the CPU. Would you like instructions on how to do that?
It seems you're asking about clearing the CPU. Would you like instructions on how to do that?
I understand your point. Lower temperatures are achieved with liquid metal, but you might consider using kryonaut. If you're employing liquid metal, it's best to reattach the heatspreader (IHS) carefully, since you don't want to disturb it during reinstallation.
I applied a tiny quantity of heat-resistant silicone adhesive in every corner of the IHS during my delid process.
Start with a solid cooler to lower your temperatures effectively. If you're not satisfied, consider moving on.
But hold on, I just noticed how massive this cooler is... Would it actually fit with my mid-tower NZXT H510 case? I'm curious...
I watch a video showing my process. The main idea is to use less liquid metal. I consistently share the drop from the die with the IHS, since it's sufficient.
ye, i think you read same thread i did, guy had gone from LM with standard IHS, to copper and standard (good quality) TIM and copper worked way better (he said he thought his initial LM application wasn't great, but still) Big thing is its pre-lapped so yeah, you could take a lot of time lapping your own CPU, but if you have the money this is likely more fool proof since its easier then you'd think to screw up lapping, end up at odd angle and not have a good flat and level surface, similarly good kits feature larger surface area then standard. this is quality name brand iirc https://rockitcool.myshopify.com/product...r-lga-1150