Intel exploring chiplet architecture for future chips.
Intel exploring chiplet architecture for future chips.
There are still many unknowns at the moment. We can try to determine the size and match it with existing products. I’ll need to review the video later and guess the number of pads, checking if that fits what we already know. What might each of those four blocks represent? Are they identical or serving different purposes? Could this be Foveros? Since the four squares look alike, but other images had different layouts, it doesn’t seem like a complex stacking setup. This appears to resemble standard four dies on a substrate rather than something more advanced.
Examining the bottom pads reveals a count of 1156. LGA1156 seems quite old. A quick check suggests its layout matches older designs, except for the unusual absence of capacitors and other components at the base. The numbers 1150, 1151, and 1155 appear distinct. I remember Intel once bonding dies together in earlier models, but that doesn’t seem to apply here. Anyone have more insight? It appears this was an experimental CPU with eight cores. Nothing groundbreaking about it.
AMD's approach seems familiar—it’s mainly about using chiplet technology for multi-chip packaging. Intel has experimented with similar ideas before, such as with the Pentium D Smithfield and Core 2 Quad. What stands out is AMD’s decision to separate the CPU chipset features from the main die and integrate them separately. This monolithic design retains some advantages, so if engineers can overcome the challenges it brings, it could be a viable strategy. In fact, AMD’s recent work with Zen 2 might introduce new complexities compared to Zen 1, since managing two components instead of one adds another layer of difficulty.