Intel 12th Gen chip and motherboard issues with bending
Intel 12th Gen chip and motherboard issues with bending
I saw some videos on YouTube and posts on Reddit discussing issues with the Intel processor after installation. The 12th generation chip tends to be taller, which can cause pressure on the middle edges and raise the long sides slightly when placed on the motherboard. This results in a slight bending effect. The fix suggested is using an Intel CPU contact frame. Is this really a real concern? Have others experienced this problem? Does anyone know if this could influence the CPU temperature or cause lasting damage to the board or processor? I built my PC three months ago with an Intel i5 12400 and an ASUS TUF gaming B660M-E motherboard. I don’t have funds for a premium Intel contact frame. I mainly code and browse online; I’m not concerned about overheating, but if it could permanently harm my hardware, I’d need to invest in one. Could this banding affect the longevity of my motherboard and CPU?
Spoiler I think Splave had an even more extreme issue, but I can't locate the photo. EDIT: I found Splave's post confirming this is the actual ILM off the board. The whole thing bends, which explains why the CPU gets bent. Yes and no. The chip will stay permanently bent once in the socket, though it won't be damaged. The CPU and board still function properly even when bent at that angle. It mainly impacts cooling performance, which is the only concern regarding longevity. With a 12400 model, this shouldn't be a big issue. Edited May 4, 2023 by RONOTHAN##
Yup and yup. There are a fair few people here that complain about high temps, 1 contact frame later and well it's a lot better. Basically anyone with a i9 needs it because well those run stupid hot. If your temps are fine then don't bother.
It shouldn't be this way. The flexibility is defined in the spec.
Many coolers have a convex shape to some extent, but most fall short of meeting the demands of the latest generation CPUs such as the 12600K, 12700K, and 12900K. This becomes a significant concern mainly for high heat output processors like these. For lower-end models like the 12400, the heat generation is insufficient to cause problems except with the most basic cooling solutions.