His clip about the 11900k delid with liquid at -10°C could clarify the high temperatures involved.
His clip about the 11900k delid with liquid at -10°C could clarify the high temperatures involved.
The setup for their regular IHS/solder might need adjustments to achieve the expected 10-degree improvement. The video appears to be early testing rather than a final result, showing promising initial findings after delamination. The PCB is thicker and positioned higher, but careful handling is required to avoid damage during the process.
This seems unusual. It might hurt Intel if this applies to many more devices. The 11th generation owners wouldn't be pleased.