High temps - delidded i5 7600k
High temps - delidded i5 7600k
Hello, I have replaced the stock Intel TIM with Coolaboratory Liquid Ultra on my i5 7600k. I evenly applied the liquid across the die and a small amount on the heatspreader. All black silicone was removed and the heatspreader was reattached using high-temperature red silicone. I placed it in the socket to secure it and prevent any movement. My cooler is a Cryorig H7 Quad Lumi, which I just purchased. Idle temperatures are 37/45°C. At stock speed, under AIDA64, temperatures range between 55/63°C. At 4.8 GHz, the temperature reaches 80/85°C. At 5 GHz, it hits 90°C. Using IntelBurnTest, the readings are even higher—about 10°C above what I expected. The paste between the heatspreader and CPU is Arctic MX-4, and it was well spread out. I re-applied it three times to ensure the cooler was properly seated. To me, the temperatures seem a bit elevated, or could they be normal? The ambient temperature was around 25/28°C during testing. The case was open during the tests.
System specs:
MOBO: Asus Z270E Gaming
CPU: 5 7600K
RAM: 16 GB (8x2) DDR4 G.SKILL TRIDENT Z RGB. 3200MHz
GPU: Asus GTX 970 Strix
PSU: EVGA 600W 80+
Hello, I have unlocked my i5 7600k, swapping the original Intel TIM for Coolaboratory Liquid Ultra.
I evenly applied the liquid across the die... and a bit on the heatspreader.
All the black silicone was removed, and the heatspreader was reattached using high-temperature red silicone.
I put it into the socket to apply pressure and prevent any movement.
My cooler is a Cryorig H7 Quad Lumi, which I just purchased.
Idle temperatures: 37/45°C
At stock speed... under AIDA64, temperatures are between 55/63°C.
At 4.8 GHz, 1.29 vcore
They reach 80/85°C.
At 5 GHz, 1.31 vcore
They reach 90°C.
And that’s just AIDA. If I run IntelBurnTest...
The temperatures are quite high... about 10°C higher than expected.
The paste between the heatspreader and CPU is Arctic MX-4, and it’s well spread. I re-applied it three times to ensure the cooler was properly secured.
To me, the temperatures seem a bit elevated... or are they normal?
Ambient temperature is around 25/28°C.
The case was open during testing.
System specs:
MOBO: Asus Z270E Gaming
CPU: 5 7600K
RAM: 16 GB (8x2) DDR4 G.SKILL TRIDENT Z RGB. 3200MHz
GPU: Asus GTX 970 Strix
PSU: EVGA 600W 80+
That’s not normal. I would expect temperatures 20-30°C lower at those voltages. I wouldn’t have reopened the lid without testing it—CPU could have been reinserted, and the lid (IHS) secured with the retention bracket. It seems you might have applied too much adhesive and didn’t do a better job than Intel. Now you’ll need to figure out how to take it apart again.
You used a much thinner layer of thermal paste than Intel did, and it looks like the IHS isn’t making contact with the die.
When I unlocked my Haswell, it was sitting in the socket with the retention bracket holding the lid in place for three years. I only glued it down with some epoxy when selling it, using a very small brush to carefully touch each corner of the lid, then tested it, packaged it, and sent it off.
I re-lid it three times... trying to minimize silicone use.
The liquid compound matched exactly what I saw in a video (hard OCp).
Each time I re-lid, I added more. It seems there isn't too little of it.
I can re-lid again, but I've already finished the liquid compound.
For thermal paste, I only have MX-4 and Cryorig CP7.
Fr0z3n :
I have relidded it 3 times... making sure there was as little as possible silicone.
The liquid compound was exactly the same as i seen on a video (HARD ocp).
And i added more every time i relidded.. So i don't think there is too little compound.
I can delid again, but i have finished the liquid compound now.
Im not saying you've used too little compound, im saying forget about gluing the lid back down, too much silicon possibly holding the lid too high.
Once youve put your liquid ultra on the die, very carefully place the chip into the socket, put the IHS on top, and use the socket retention bracket to hold it in place, dont use any glue.
Do you have any other TIM you can use, I used AS5 whilst waiting for my liquid ultra to arrive and was getting better results than you are.
Sure, I can attempt that. Since you don’t have any more liquid compound left, it’s fine to use what’s available on the IHS. Or should I stick with MX-4 until you get a new CL Ultra? Please let me know.
Sure, let's adjust this for clarity while keeping the same tone and structure.
Ok, I can attempt that. Since I don't have any more liquid compound left, it's fine to use what's on the IHS? Or should I put MX-4 until I get another CL Ultra? Thanks. Just use whatever you have available, as anything will be better than the temperatures you're seeing now—just make sure to clean off the CLU first.
Seanie280672 :
I can attempt that. Since I don’t have any more liquid compound, it’s fine to use the same as on the IHS? Or should I switch to MX-4 while acquiring a new CL Ultra? Please be honest, whatever you have will be better than what you’re seeing now, just ensure you clean off the CLU first.
I tried it. Cleaned all the silicone, cleaned and lightly scraped the heatspreader. I used the same Liquid ultra that was still available on the die, and the temperatures are the same—about 3 to 4°C lower.
I’m now running Aida at 4.8 Ghz, 1.29 vcore... after a 3-minute test, I reached 80°C on Core #3 and #4.
🙁
I tried again by removing all the Liquid Ultra and using MX-4.
If I get the same temperatures, it must not be an adelid/relid problem.
Update: Cleaned everything thoroughly. It was tough removing all the Liquid Ultra from the die.
Polished the IHS both inside and outside, also the cooler.
Applied MX-4 between Die and IHS.
Unfortunately, the result is still the same—worse even than before.
I’m unsure what might be causing this. Any further advice would be greatly appreciated.