Even after removing the case (i7 4770K), temperatures remain worse.
Even after removing the case (i7 4770K), temperatures remain worse.
I recently encountered an issue with my CPU, it remains unresolved. Idle temperatures stay around the mid-40s, and during stress tests, one core even hits 100 degrees. The paste I applied is the Thermaltake TG2. What went wrong? I'm using a Corsair H100i v2 and can't exceed 4.4 GHz @ 1.27V without BSOD.
Mac n Cheese,
Using standard silicon TIM between the IHS and the Die causes issues because of a phenomenon known as "pumping" or "pump-out." This happens when the TIM leaks from the gaps due to repeated heating and cooling, leading to poor performance. As a result, you'll need to reapply TIM often since the core temperatures rise quickly after each failure period.
Although Intel's TIM has lower thermal conductivity than indium solder, it resists pump-out well, making liquid metal TIM the better choice for delidding. Also, if the IHS shifted during latch down, it can ruin your TG2, reducing its effectiveness. This is why...
It seems your cooler might be out of place or the pump isn't working. Try reseating the cooler and, once the system is running, observe the tubing for any movement or noise from the pump. If you don't hear it or see movement, the pump may be faulty.
Mac n Cheese, When a standard silicon thermal interface material is placed between the IHS and the die, it doesn’t work well because of an issue known as "pumping" or "pump-out." This happens when the TIM leaks from the gap between the surfaces because of repeated heating and cooling. As a result, it becomes necessary to reapply the TIM often, since the core temperatures rise gradually over short intervals when the TIM fails. Although Intel’s TIM has lower thermal conductivity than indium solder, it is very resistant to pump-out, just like liquid metal TIM. That’s why only liquid metal TIM should be considered for delidding. Moreover, if your IHS shifted during latch down, it likely blurred your TG2, reducing its effectiveness. This is why it’s advised to bond the IHS firmly in place to avoid such movement. Here’s a quick thermal conductivity comparison: - Indium – 81.8 W/mk (used in 2nd Gen and earlier processors) - Liquid Metal TIM - Die to IHS: Thermal Grizzly Conductonaut – 73.0 W/mk (latest model) - CoolLaboratory Liquid Ultra – 38.4 W/mk - CoolLaboratory Liquid Pro – 32.6 W/mk - Typical Silicon TIM - Cooler to IHS: Thermal Grizzly Kryonaut – 12.5 W/mk - Arctic Silver 5 – 9.0 W/mk - Gelid GC Extreme – 8.5 W/mk - Arctic Cooling MX4 – 8.5 W/mk - Silicon Lottery – [link](https://siliconlottery.com/collections/a...ucts/delid) A trusted brand that tests, stores, and sells overclocked, delidded "K" CPUs. They also provide affordable professional delidding services. Their data shows typical core temperature reductions after delidding: - 7th Gen... Kaby Lake X – 12° to 25°C - 7th Gen... Kaby Lake – 12° to 25°C - 6th Gen... Skylake X – 10°C to 20°C - 6th Gen... Skylake – 8°C to 18°C - 5th Gen... Broadwell – 8°C to 18°C - 4th Gen... Devil's Canyon – 7°C to 15°C - 4th Gen... Haswell – 10°C to 25°C - 3rd Gen... Ivy Bridge – 10°C to 25°C Silicon Lottery currently favors Thermal Grizzly Conductonaut for delidding. Before using this, they previously used CoolLaboratory Liquid Ultra. Additionally, here’s an interesting article: The Truth about CPU Soldering https://overclocking.guide/the-truth-abo...soldering/ For more details on processor temperatures, check out this guide: Intel Temperature Guide
CompuTronix says it all. But I’ll include a minor detail...
TG2 isn’t meant for use between the CPU die and IHS.
The same mistake others made with the MX4.
So the connection should be liquid metal, while between IHS and CPU cooler, regular thermal paste is fine.
Is it safe to run without the IHS? Also, could you tell me where to order the clu liquid metal stuff? It isn't widely available here, and I want to keep shipping costs low. 😊
(I live in the Philippines) Oh yeah, I almost forgot. If I were to replace my chip, what type of seal should I use?
Mac n Cheese :
If I had to replace my chip, which type of seal would be best?
This item or a comparable one:
Permatex Ultra Black Hi-Temp RTV Silicone Gasket Maker -
https://www.walmart.com/ip/Permatex-Ultr...3=&veh=sem
Mac n Cheese :
To the guys who assisted, I can't thank you enough. By the way, where can I get Coolaboratory Liquid Ultra with low shipping costs?
It's tough because I'm not in the Philippines.
But just a reminder when you're updating the IHS.
Be careful not to overdo it. Otherwise you might increase the IHS temperature from the die, which is also very bad for heat.
Just apply a super thin layer using a toothpick to the edges of the IHS and leave nothing on the PCB.
You can find more details in the link CompuTronix posted about
Intel Temperature Guide