Discussing CPUs means looking at the central processing units.
Discussing CPUs means looking at the central processing units.
We’ve all noticed the liquid metal in the PS5, right? The heat spreaders connect to the die using this metal. Why should we be concerned? Especially with the AM5 socket, there’s a risk of leaks affecting nearby parts and the front-mounted components.
Because they aren't? Unless you remove the IHS and put LM on there yourself, there's no liquid metal in there at all. They're soldered in place, which is very different from liquid metal because at room temperature and the temperatures a CPU will reach under full load, it's not liquid.
Liquid metal remains fluid at room temperature and can move freely if enough is gathered. The die shows direct contact with the heatsink via this metal. It behaves similarly to a laptop, though unlike desktop systems it lacks a dedicated CPU heat spreader. Manufacturers have made significant efforts to address this. The foam contains to stop leaks. The main problems noticed are localized liquid metal migration, forming hotspots that could halt operation if overheating occurs. Adjusting the component and relocating the metal resolves the issue.