Die ausgesetzt, ohne Flip-Chip-Prozessoren
Die ausgesetzt, ohne Flip-Chip-Prozessoren
There are older x86 processors where the die was sold separately rather than being a flip-chip package. These typically came from earlier manufacturing runs or specialized variants. Many were likely encapsulated at the time.
I recall some vintage Athlons running bare but it's definitely much earlier than dual-core processors.
I checked the Duron 800 with an 180nm process and spotted the die. So far, I haven’t been able to tell if it’s a flip-chip. That brings back the memory of the P3 packaging, which shares some leads I can follow up on.
A flip chip is a component die attached to the PCB with exposed solder joints. The distinction between BGA and flip chips lies in the placement of the solder points beneath the board, which remain hidden. Socket 462 chips are not considered flip chips. A PLL chip serves as a good illustration of a compact flip chip.
I might have misinterpreted the terms. I'm searching for a chip where the active circuit isn't on the same side as the solder. It seems tricky because close proximity to the contacts is needed. I'm aiming to capture high-resolution images of an x86 CPU using a donor die. I've had trouble removing the substrate from the die so far. I'm worried about damaging my home or risking getting flagged with unsafe chemicals. I remember once the die was flipped, which might explain why an older model could be useful.