Delidding a Xeon X5675 (LGA1366)
Delidding a Xeon X5675 (LGA1366)
I'm checking CPU upgrades for my upcoming Xserve3,1 and discovered the Xeon X5675 is the best option available—though the X5690 could work but would require a much more powerful TDP chip. The X5675 offers the fastest 95W TDP performance, which matches what I need. Since Xserve CPUs are delidded, I’d have to remove the delamination first. This is something I’ve never done before, so it might be challenging. What tools would I need? I’ve heard the soldered IHS makes it harder to work with. Any guidance would be greatly appreciated, especially for someone new to this process!
The issue is that the Xserve doesn’t support overclocking, making it tricky to get six-core processors.
For my Mac Pro 4,1 which also runs delidded Xeons, I swapped them for dual X5680 units and had them soldered together. The tools I relied on were a single-edge razor blade (available in bulk at a reasonable price) and a bench vise. I positioned the IHS on one side of the jaw while placing the substrate on the other. Using tape, I shielded the sharp edges of the vise jaws, and then a microfiber cloth was placed between the cloth and the CPU. Once the solder or adhesive holding the IHS in place was removed, I gently worked it off. I alternated flipping the CPU to avoid shearing from one side and relied on gradual fatigue for delidding. This technique is what I call the vise method. After removing both CPUs, I sanded them with 500-grit paper taped down to a glass sheet, working carefully to remove any leftover solder without damaging the silicon. Eventually, one CPU succeeded while the other remained functional but had an issue with a RAM channel that failed during a cold boot. Restarting the Mac Pro after a load test resolved the problem. I’m considering getting another X5680 but haven’t decided yet.