Delidded 7700K temps
Delidded 7700K temps
Hi,
I'm experiencing a delidded 7700K again. The first time I achieved stability with [email protected] V at around 75°C max temperature (Cinebench). After two months, the CPU started getting hotter, reaching about 90+°C on Cinebench. I tried the delid process once more and it helped bring things down to similar levels. Later, I switched to the thermal grizzly conductonaut instead of the kryonaut I used before. That reduced the CPU max temp to around 70°C or less. I can now run my PC stably at [email protected] V.
I'm worried this might happen again because it seems a bit hotter now than after the previous fix, so I want to understand what could be causing it. I suspect it might not be the glue I removed, and I'm confident I followed all the right steps. Any additional advice would be great. Thanks!
I've observed that when the CPU isn't reattached via silicon, the liquid thermal solution tends to dry and contract during cooling, creating hotspots. It might be useful to assess the evenness of distribution and consider reattaching with silicon if needed.
I observed in several instances where the CPU wasn't reattached via silicon, the liquid thermal solution started to dry and contract as it cooled, creating hotspots. I would investigate whether the evenness of distribution was affected and consider reattaching with silicon if needed.
Thanks for your response.
What should I do next? Should I open the CPU again, spread the solution, scrape the old adhesive, and seal it with silicone?
The glue currently on the CPU, which wasn't cleaned, is now dry and ineffective.
Would it be preferable to remove the IHS and install the watercooling pump directly onto the CPU?
Are there any additional steps required for this approach?
Apologies for all the questions, and thank you again.
I noticed something important in cases where the CPU isn't reattached via silicon. The liquid thermal solution tends to dry and shrink as it cools, creating hotspots. I think it would be better to check the evenness of distribution and, if necessary, reattach with silicon. Thanks for your help.
What I should consider is opening the CPU again, spreading the liquid solution once more, scraping off the old adhesive, and sealing it with silicone. The current glue on the CPU is dry and ineffective. Would it be better to remove the IHS and install the watercooling pump directly onto the CPU? Are there any additional steps I should follow?
Thank you for your clarification. Now that I have a better understanding, I plan to clean the compound, remove the old adhesive, and reapply the thermal grizzly. Without the old material, the IHS won't apply pressure evenly across the die. If that happens, I'll try reapplying the IHS with fresh silicon.
I noticed a pattern in cases where the CPU isn't reattached via silicon; the liquid thermal solution tends to dry and shrink upon cooling, creating hotspots. I’d like to verify if the distribution is even and consider reattaching with silicon if needed. Thanks for your reply.
What I should attempt next is to reopen the CPU, spread the liquid thermal solution again, scrape off the old adhesive, and then seal it using silicone. The current glue on the CPU is no longer effective and has dried out. Would it be better to remove the IHS and install the watercooling pump directly onto the CPU? Are there any additional steps required for this approach?
Apologies for all the questions; thank you again.
Now that I have a clearer understanding, I plan to clean the compound, remove the old adhesive, and reapply the thermal gasket. Without the old material, the IHS won’t apply pressure evenly across the die. If that’s the case, I’ll proceed with reapplying the IHS using fresh silicon.
Since I ran out of the grease paste, I ordered another 5g. Once it arrives, I’ll follow your advice and update accordingly.
I hope this will resolve the issue and complete the last attempt on this CPU. Thanks.