Could you confirm if the damage occurred while applying thermal paste?
Could you confirm if the damage occurred while applying thermal paste?
Hello everyone,
I recently assembled my PC and encountered some issues while applying the thermal paste. The product I used was quite thick and hard to spread with a credit card, causing some to spill over the CPU edges. To apply it more smoothly, I lifted the retention arm so the metal bracket wouldn’t interfere. While spreading the paste without the socket latch in place, the CPU moved slightly back and forth because of the pressure from the card. Once the paste was applied, I secured the CPU again and completed the installation. After that, I ran Cinebench, and the results are within normal expectations. Temperatures also seem typical under load and idle conditions.
I’m a bit anxious because online forums often share stories about people damaging their motherboard pins, which makes me worry I might have made a mistake too. I also tend to overanalyze things. Usually I’m just a quiet reader, but I created an account specifically to seek advice on this matter.
I wanted to ask:
Could the slight CPU movement during paste application (with the socket open) have affected the pins or the CPU?
Can I rely on the Cinebench scores and temperatures as proof that everything is functioning correctly?
Thank you in advance for any guidance or reassurance!
Everything is possible. But in your case, give amends to lady luck.
Yes.
If there would be CPU socket pins issue, for the most of the times, PC won't even POST, let alone boot to OS and CPU being able to complete the bench.
Moving forwards, don't spread the paste. Put small pea sized blob in the middle of CPU IHS and put cooler on top, while screwing down the screws in X pattern.
Thank you for your quick response. You seem relieved now. Earlier, I tried the blob method during a build and it was too much, which caused issues. That’s why I plan to use the credit card method this time. Anyway, I generally dislike thermal paste.
😀
Next time I’ll try the blob again.
Place a small amount of turd in the middle of the CPU. Advanced design choices are ineffective. A thin layer will spread heat evenly between the CPU and heatsink.
Choose your thermal paste wisely. There are both conductive and non-conductive options. Keep the conductive type away from the hands.
There are various thermal pads available for different needs. Most are thicker with lower conductivity compared to paste, but some specialized pads exist for CPUs. For example, Thermal Grizzly Carbonaut offers a reliable solution: https://www.thermal-grizzly.com/en/carbonaut/s-tg-ca or Thermal Grizzly KryoSheet: https://www.thermal-grizzly.com/en/kryos...g-ks-24-12. Carbonaut is non-conductive and works well with desktop CPUs. KryoSheet, however, conducts electricity and requires careful handling; it’s typically preferred in laptops where superior cooling is essential. Standard pads are common for GPUs, especially when components sit at different heights and need even contact with a cold plate.