Could we try without a liquid metal?
Could we try without a liquid metal?
Imagine Linus using a copper cold plate and solder to connect it to the IHS on the CPU. He'd try to see if it sticks properly, possibly by gently smashing them together if the solder stays fluid. If it works, gaps would fill and create a bowing effect. Shawn Saylor might be interested in the idea. See you next time!
The purpose seems unclear. You're introducing more copper for heat transfer, but it might not be necessary. Going this far could be unnecessary and increase risk.
The attempt to handle it is actually more problematic than simply removing it initially. Deleting it is easier to undo than dealing with this issue.