Consider replacing the LM if it's no longer performing effectively.
Consider replacing the LM if it's no longer performing effectively.
Been using it for three years since my 8700k with Thermal Grizzly Conductonaut. It's been running on a Cryorig H7 Quad Lumi, just changing cases occasionally. I'm thinking about upgrading the cooler for practical reasons—temperatures are still good even at 5GHz, and the CBR23 can hit 78°C. But I'm worried that loosening the tension might weaken the bond between the IHS and the die, possibly requiring a new application of the liner. Some folks suggest replacing it, others say to keep going. So far, I haven't seen any temperature issues over the past three years.
Taking out a cooler means it needs to be changed, no matter which thermal interface was applied.
When the liquid metal is positioned between the die and the heat sink, you don't have to reapply it unless you've removed the CPU from the socket. The Intel socket effectively keeps the heat sink in place on the die. Wipe away any residue from your heat sink's surface before applying fresh paste when switching coolers.
Velcade has addressed the issue well; you might find a brief article from Gamer Nexus helpful on this topic: https://www.gamersnexus.net/guides/3359-...quid-metal. It seems LM could perform even better than premium thermal pastes, and you shouldn't worry as long as your temperature readings stay stable.
Thanks for the responses. I'm thinking about picking a different cooler for style.