F5F Stay Refreshed Power Users Overclocking Can thermal paste degrade with use?

Can thermal paste degrade with use?

Can thermal paste degrade with use?

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emstay26
Senior Member
441
08-03-2023, 04:29 AM
#21
Yes, if AS 5 were genuinely 99.9% silver it would be pure silver, not a paste.
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emstay26
08-03-2023, 04:29 AM #21

Yes, if AS 5 were genuinely 99.9% silver it would be pure silver, not a paste.

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UnsinkableSam
Junior Member
3
08-03-2023, 01:23 PM
#22
Confirm if your concern is valid, as the idea that the paste prevents heat sink melting is questionable. Changing it shouldn't pose an issue once applied.
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UnsinkableSam
08-03-2023, 01:23 PM #22

Confirm if your concern is valid, as the idea that the paste prevents heat sink melting is questionable. Changing it shouldn't pose an issue once applied.

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fritoslover
Junior Member
3
08-04-2023, 09:35 PM
#23
No, the paste is intended to close the tiny gaps in the HS, mainly. Most of it is pushed out when you secure the HS, leaving only the small channels in the HS and the processor. This process isn't about sticking anything down or stopping melting; its goal is to fill empty spaces and boost heat transfer.
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fritoslover
08-04-2023, 09:35 PM #23

No, the paste is intended to close the tiny gaps in the HS, mainly. Most of it is pushed out when you secure the HS, leaving only the small channels in the HS and the processor. This process isn't about sticking anything down or stopping melting; its goal is to fill empty spaces and boost heat transfer.

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pedroluis9
Junior Member
4
08-07-2023, 11:51 PM
#24
The thermal paste transfers heat from the CPU to the heatsink. If both components had perfectly flat, smooth surfaces ensuring ideal contact, it might not make a difference. However, at a microscopic level, the surfaces aren't flat enough, and trapped air acts as a great insulator. Without paste, your CPU could burn, but it wouldn't melt. Aluminum remains solid until 660°C, copper up to 1084°C, and silicon up to 1414°C.
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pedroluis9
08-07-2023, 11:51 PM #24

The thermal paste transfers heat from the CPU to the heatsink. If both components had perfectly flat, smooth surfaces ensuring ideal contact, it might not make a difference. However, at a microscopic level, the surfaces aren't flat enough, and trapped air acts as a great insulator. Without paste, your CPU could burn, but it wouldn't melt. Aluminum remains solid until 660°C, copper up to 1084°C, and silicon up to 1414°C.

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entech
Member
210
08-10-2023, 09:48 PM
#25
I believe there isn't one solution that fits all situations. A computer not moved often might require less reapplication than one used frequently at LAN events, like shaking it during transport could damage the CPU-heatsink connection.

Moreover, a well-cooled system with good airflow maintains a narrower temperature range compared to a poorly ventilated setup that switches rapidly between very low and high temperatures. The variation in heating and cooling cycles between different designs can be substantial. These fluctuations, particularly their strength, might influence how the CPU-heatsink interface transitions from dry to damaged.
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entech
08-10-2023, 09:48 PM #25

I believe there isn't one solution that fits all situations. A computer not moved often might require less reapplication than one used frequently at LAN events, like shaking it during transport could damage the CPU-heatsink connection.

Moreover, a well-cooled system with good airflow maintains a narrower temperature range compared to a poorly ventilated setup that switches rapidly between very low and high temperatures. The variation in heating and cooling cycles between different designs can be substantial. These fluctuations, particularly their strength, might influence how the CPU-heatsink interface transitions from dry to damaged.

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