BGA components, reproducibility, and custom modifications
BGA components, reproducibility, and custom modifications
I'm uncertain about the correct location for this discussion. Many systems use soldered low-density high-performance CPUs, but it looks like these chips aren't regularly reused or resold with adapters for standard sockets. This approach is technically possible, as demonstrated by some creative individuals. My interest lies in understanding why enthusiast and professional boards don't have BGA-style sockets for high-end chips, especially since such designs could enable memory upgrades on GPUs and other components. I'm also curious about the technical barriers preventing BGA-compatible boards with LGA sockets, and whether there are any practical reasons manufacturers avoid creating them.
The main goal of BGA is to reduce size and improve compactness. Applying it to a socket would undermine that purpose. Instead, opt for LGA directly.
The goal is to adapt these low-power components for use outside space-sensitive environments, enabling upgrades such as replacing solder in RAM with LGA-style sockets and friction-fit connectors similar to replaceable bios chips, while keeping board footprints small. For RAM improvements, I aim for this solution wherever soldering is common, except in the smallest devices like smartphones and wearables. Regarding CPUs, whether they’re soldered to adapters or designed with BGAs to standard sockets, it would help reduce waste by allowing reused chips in silent systems.