Too much thermal paste can cause overheating and damage components.
Too much thermal paste can cause overheating and damage components.
I received my MasterGel Maker today and wanted to replicate their setup exactly. I completed three edge-to-edge IHS tests. My gel offers slightly better coverage compared to theirs. Previously, I never experienced spills during spreading, except during very large applications.
Using non-conductive pastes makes it tricky to get too much, as long as it doesn't leak beyond the edges and touch the CPU connections. Slightly more is likely okay than less.
This has always been my understanding too. I ran out of NT-H2 just before getting the MasterGel Maker, and the application felt very light—temperatures weren’t as steady. I relied on the spread method with my 7700K using an AIO, which kept temps stable. I often worry about reapplying because I know exactly where my temps were; if they drifted, it was likely due to the application, not other factors. Here’s a photo of my NT-H2 setup. I was running at 28–32°C idle at 4.1GHz, but I’m now re-clocking my Ryzen 3600 up to 4.4GHz to test lower voltages per clock speed. Current max temps are around 71°C at 4.2GHz. It’s air cooled, so I don’t expect AIO performance, but I think a better thermal paste could still make a noticeable difference—even a few degrees counts.
I usually achieve optimal temperatures by applying the paste in a thin layer using a plastic card. My previous setup used an X shape, and I’m curious if lowering it slightly would help if I reapply.
I concur, I've experimented with X, dot, and spread. I typically use X, but with NT-H2 it produces results quickly and often excessively. The sole reason I opted for spread on this product was because the MasterGel Maker tube includes a built-in spread applicator, which is convenient.
The majority of the warmth comes from the core of the IHS, which is a solid design choice. Similar patterns often appear in other dot applications too. I’m not sure about the image’s precision, but it’s interesting to observe how various systems look.
I usually avoid dots or X marks since they don’t match the CPU shape. In my view, a square provides good even coverage with minimal movement. However, it really depends on how thick you apply it. When using Naked Die, full spread is ideal without any deviation. That’s a strong point about complete coverage. People worry about air gaps, but the key is twisting back and forth on the CPU when placing the cooler just like you’d remove it. The best results come from smoothing the cooler and CPU to perfection. You can cut down on TIM usage during installation. Most IHS plates are curved, particularly with AMD’s designs. Because AMD chips have cores in three or four spots, aim for maximum coverage even if slightly excessive. You should ensure the paste contacts 100% of the CPU cooler and IHS area. That’s my opinion.