Removing the CPU from a device that has an old, possibly hardened thermal compound on the die
Removing the CPU from a device that has an old, possibly hardened thermal compound on the die
Hello, I just purchased a Delid Die Mate 2 to finally clean out my 8086K (which is essentially a tested 8700K). I'm a bit worried about using it now since the CPU is already several years old and it tends to get quite hot. I'm concerned the thermal paste might have dried up or hardened. Could I possibly remove the die during the delidding process? Also, if I decide to preheat it with a hot air gun, what temperature should I aim for? Thanks for your help.
Even when the TIM is very hard, it doesn't match the bonding strength of the method used to attach the silicon to the base material.
It can resemble chalk even when hardened; I've encountered this before with chips that have been delidded. It simply breaks off easily with a fingernail. After cleaning and reapplying TIM, ensure the lid is placed back in the same position as before for proper contact. It's advisable to remove the old gasket material to maintain flatness against the die, though you can keep it if it helps. The usual recommendation is to clean it off completely. Once back in the socket, the latch pressure should help secure it. Verify the lid orientation matches the instructions, and check temperatures under load post-assembly. Minor thermal variations across cores are acceptable unless they exceed 10°C; otherwise rework may be needed. Make sure you have all necessary materials ready before proceeding. Good luck!