Optimal mounting system for 13th generation models
Optimal mounting system for 13th generation models
Check out the Z790 hero motherboard options. For your 13900ks, ensure the contact frame screws are appropriately sized. The best frame depends on your specific model—compare compatibility charts to confirm fit.
Based on what I've observed, either the Thermalright or the Thermal Grizzly seems to be the top choice. The Thermalright is notably simpler to set up, while the Thermal Grizzly might offer a bit more memory overclocking potential, though I haven't noticed a clear advantage in practice. I opted for the Thermalright mainly because it's more affordable and provides a reliable performance with a lower chance of mistakes. If you prefer the Thermal Grizzly, it's perfectly acceptable too. Also, it seems unlikely that the screws are too short for the Z790 hero—this just doesn't seem feasible. Intel handles the ILM technology and supplies it to board manufacturers, while ASUS doesn't produce their own specialized versions with shorter screws. The contact frames are built around Intel's ILM specifications, ensuring compatibility with any board featuring an LGA 1700 socket.
Hey, more I read about their inability to install it, the more it looks like they’re just clueless on Reddit. The thermal part seems solid. I saw one in action, but I’m not sure if it’s just for a direct die block or works with other devices too.
thermal grizzly screws are often found too short for certain motherboards. This problem is also linked to ThermalRight, which may have contributed to the issue.
Check the top options for purchasing. The newest model is likely the latest release. You’ll notice several variations from ThermalRight.
Iv experienced no problems with the 13600k. The contact frame was needed because all cores were within 5°C of each other, which is typical for a soldered or delidded chip. Have you checked your CPU and seen if any cores are excessively hot? Asked whether it was just one core or all the even ones that are overheating.