It would likely matter. The task is feasible, but results may vary.
It would likely matter. The task is feasible, but results may vary.
Interestingly, using liquid metal as thermal paste is possible. The temperature differences between it and a good thermal paste would likely be noticeable.
Liquid metal can gradually move over time, which might leave traces on your GPU or even inside the socket unless you take precautions. You should safeguard anything that could be affected. Consider using Kryonaut to avoid even a small chance of damage.
Conductonaut can serve as thermal paste, as noted on Thermal Grizly's site. Just avoid using it with an aluminium coldplate cooler—though only budget coolers have this feature, not sure why you'd combine a cheap cooler with a high-quality paste. The temperature gap between stock paste, good thermal paste, and Conductonaut typically stays within 5-10 degrees of each other, depending on other factors. Often the difference is even smaller.
It's worth noting that it may be possible to release it, though I'm not sure if my understanding is correct.
It's a situation where possibilities exist but practicality is limited. I haven't encountered many examples of it disappearing, yet given its viscosity and conductivity, it seems like a real issue. In my earlier post I might have mentioned it could be cooler, but using liquid metal as thermal paste between a cooler and IHS isn't worth the effort. It might be better to focus on your delidded CPU and use standard thermal paste instead. Running regular paste would likely make a noticeable difference.
Sure, it's a fair point. The effort involved seems more about practice than necessity, and the variation wouldn't be significant.
I've reviewed the same instructions and was advised to apply a clear coat of nail polish around the die to prevent leaks. Since I don’t have enough balls yet, I’m using Kryo instead.
I own a bare AMD processor and don’t run the LM on it. It’s not necessary. 8700K works well. There’s a significant temperature reduction compared to the stock paste under the IHS. Also, the indium in the LM is similar to solder but a bit less effective in liquid form since it doesn’t form a strong bond.