Innovative method for cooling without thermal paste
Innovative method for cooling without thermal paste
Considered an alternative approach instead of thermal paste. Instead of using paste, we'd install slots on both the CPU IHS and Cooler Pad, then align them before mounting the CPU in the motherboard socket. This should eliminate any air gap and potentially boost thermal efficiency. Not sure if anyone has tried it before. I’d appreciate if Linus experiments with it and compares the outcomes to standard setups.
I understand your point, but achieving this would demand an extremely accurate manufacturing method with minimal allowances. It would be significantly more costly than our current approach. Polishing a metal surface is far simpler. Because matching tight tolerances across parts from different makers would be difficult, your "jigsaw" design would need a larger air space, meaning you'd require more thermal paste.