IDLING 10900K
IDLING 10900K
I'm not entirely confident yet, but I believe I'll use the delidding tool to tackle this. I also intend to apply direct die cooling. The main point is understanding the impact of conductonaut versus kryonaut here. As suggested by gamer nexus, using standard thermal paste instead of LM is preferable for long-term stability and performance. While LM works, it offers only slight benefits compared to using paste in a direct die setup. Most folks overlook that the real gain from delidding and re-lidding with liquid metal comes from eliminating the silicone layer and air gap between die and IHS. LM helps a bit, but isn't the full picture. Regarding temperature differences, I don’t know the exact range, but I’m curious about how much more efficient direct die cooling would be versus kryonaut. You mentioned a concern about switching to kraken z73 with a copper coldplate—it’s conductive and could pose risks. Also, there was a YouTube video showing trouble getting good contact between an Arctic LF2 and CPU die using the same frame as rockitcool’s direct die. Could that same issue arise with kraken z73?